News

2019.06.19Exhibition

We will exhibit at MF-Tokyo 2019

We are pleased to inform of our participation to MF-Tokyo 2019.
The highlight of the show is the total line (actual machines)
customized to the ultra-thin motor core lamination for EV;
High precision press EV-315 (Nidec Minster),
Push-pull feed system with loop control,
and Index system (Nidec Vamco)
and Material thickness measuring device
(Nidec SYS, joined to Nidec group in March 2019)
In addition, the new extra-wide version,
which has ultra-wide bolster, of the knuckle link press ANEX
is also on the booth.
Much information such as product features
more than catalog and web site is available.
We look forward to seeing you at our booth!

■Date July 31 (Wed) ~ August 3 (Sat) for 4 days
■Time 9:00 ~ 17:00 ※9:00~16:00 on August 3
■Place Tokyo Big Sight
■Booth No. West1 hall W1-18
■Exhibits
・Ultra-thin lamination stamping system
 EV-315-3700 (Nidec Minster)
 Push+pull NC Servo feeders (Nidec Vamco)
 Big size Index system (Nidec Vamco)
 Loop control system (Nidec Vamco)
 Material thickness measuring device (Nidec SYS)
・ANEX-40IIEW